Role Summary
We are seeking an experienced Project Manager to lead cross-functional programs across our
semiconductor design, fabrication, packaging, and test operations. The ideal candidate will drive
projects from concept through high-volume manufacturing (HVM), coordinating tightly with process engineering, equipment/fab operations, supply chain, and quality teams to deliver new products, process nodes, or capacity expansions on time, within budget, and to yield/quality targets.
Key Responsibilities
• Own end-to-end planning and execution of semiconductor projects, including new product
introduction (NPI), process transfer, yield improvement, and fab capacity/equipment installation
programs.
• Develop and maintain integrated project schedules, critical path analysis, and resource plans
across design, wafer fab, assembly/test, and supply chain functions.
• Coordinate with process, product, equipment, and reliability engineering teams to track
technical milestones such as tape-out, first silicon, qualification, and ramp-to-volume.
• Manage project budgets, capital expenditure (CapEx) tracking, and vendor/tooling procurement
timelines in partnership with finance and procurement.
• Identify, track, and mitigate risks related to yield, equipment downtime, material shortages, and
schedule slippage; escalate issues with clear recovery plans.
• Drive stakeholder communication through regular program reviews, status reports, and
executive dashboards (e.g., using Zoho Projects, MS Project, Smartsheet, or Jira).
• Partner with customers and/or foundry/vendors on program timelines, qualification
requirements, and delivery commitments.
• Lead post-project reviews and drive continuous improvement in project management processes,
tools, and templates.
Required Qualifications
• Master's degree in Electrical/Electronics Engineering, Materials Science, Industrial Engineering,
or related field.
• 3 - 7 years of project management experience in the semiconductor, microelectronics, or
related high-tech manufacturing industry.
• Strong understanding of semiconductor fabrication processes (front-end and/or back-end),
wafer fab operations, or IC packaging and test.
• Proven track record managing multi-disciplinary teams and complex, schedule-driven programs
with hard technical milestones.
• Proficiency with project management tools (MS Project, Smartsheet, Jira, Primavera) and
manufacturing/ERP systems (SAP, Oracle).
• Working knowledge of Design of Experiments (DOE), Statistical Process Control (SPC), and yield
analysis methodologies.
• Excellent communication and stakeholder management skills, with experience presenting to
senior leadership and customers.
• PMP, PgMP, or Six Sigma certification preferred.
